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Your search returned 35 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology
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Year : 1992 Volume number : 15 Issue: 05 |
Development And Analysis Of An Automated Test System For The Thermal Characterization Of Ic Packaging Technologies
(Article)
Subject:
Thermal Characteristics
,
Ic Packages
,
Packaging
,
Automated Test Equipment
Author:
Sean Cian O
Mathuna
page:
615
-
624
Transient Thermal Measurements Using The Index Of Refraction As A Temperature Sensitive Parameter
(Article)
Subject:
Transient Thermal Modelling
,
Temperature
,
Index Of Refraction
,
Temperature Sensitive Parameter
Author:
Chin C.
Lee
page:
625
-
631
Using A Thermal Simulation Model To Interpret Test Data
(Article)
Subject:
Thermal Simulation
,
Interpretation
,
Test Data Comprssion
,
Hydraulic
Author:
K
Azar
Vincent P.
Manno
page:
632
-
639
Comparison Of Plastic And Hermetic Microcircuits Under Temperature Cycling And Temperature Humidity Bias
(Article)
Subject:
Reliability
,
Plastic
,
Hermetic Compressor
,
Temperature
Author:
Lloyd
Condra
Tim
Freedman
page:
640
-
650
Thermal Interaction Of Semiconductor Devices On Copper Clad Ceramic Substrates
(Article)
Subject:
Thermal
,
Semiconducters
,
Copper Clad Aluminum Wires
Author:
Mohamad M.
Hussein
Douglas J.
Nelson
page:
651
-
657
Extensions Of The Closed Form Method For Substrale Thermal Analyzers To Include Thermal Resistances From Source-To-Substrate And Source To Ambient
(Article)
Subject:
Extension
,
Source And Channel Coding
,
Resistance
Author:
Gordon N.
Ellison
page:
658
-
666
Thermal Analysis Of A Substrate With Power Dissipation In The Vias
(Article)
Subject:
Voltage Drops
,
Modified Band Gap
Author:
B
Robert
Raed A.
Sherif
page:
667
-
674
A Semi-Analytical Method To Predict Printed Circuit Board Package Temperatures
(Article)
Subject:
Dimensional
,
Printed Circuit Board
Author:
John N.
Funk
M. Pinar
Menguc
page:
675
-
684
Transient Thermal Gradients Across Solder Interconnections In Electronic Systems
(Article)
Subject:
Manuscript
,
Ibm Researchers On Demand
,
Transient
Author:
Raed A.
Sherif
Howell B.
Schwartz
Robert A.
Brewster
page:
685
-
690
Thermal Enhancements For A Thin Film Chip Carrier
(Article)
Subject:
Thin Film
,
Chip Carrier Packages
,
Enhancement
,
Thermal
Author:
Scott D.
Reynolds
Bahgat G.
Sammakia
page:
699
-
706
Temperature Solution Of Five-Layer Structure With A Circular Embedded Source And Its Applications
(Article)
Subject:
Five Layer Asymetric
,
Embedded Control
,
Structure
,
Temperature Solution
Author:
Chen Y.
Wang
Chin C.
Lee
page:
707
-
714
Finite Element Modeling Of A Mmic Transmitter Module For Thermal/Structural Design Optimization
(Article)
Subject:
Finite Element Modeling
,
Mmic Transmitters
,
Thermal Design
,
Structural Design
Author:
Marcelle S.
Ibrahim
Leo R.
Paradis
page:
723
-
729
A Coupled Thermal Magnetic Model For High Frequency Transformers. Part I. Model Formulation And Material Properties
(Article)
Subject:
Coupled Thermal Magnetic Model
,
High Frequency Transformers
,
Formulation
,
Material Properties
Author:
Douglas J.
Nelson
page:
730
-
739
A Coupled Thermal Magnetic Model For High Frequency Transformers. Part Ii - Finite Element Implementation And Validation
(Article)
Subject:
Coupled Thermal Magnetic Model
,
High Frequency Transformers
,
Finite Element
,
Implementation
Author:
Douglas J.
Nelson
page:
740
-
747
Thermomechanical Assessment Of Plastic Coated Tab Chips
(Article)
Subject:
Thermomechanical Analysis
,
Assessment Analysis
,
Plastic Coated Tab
,
Chip Design
Author:
Peter
Alpern
Otmar
Selig
Rainer
Tilgner
page:
748
-
753
Optimal Thermal Design Of Air Cooled Forced Convection Finned Heat Sinks-Experimental Verification
(Article)
Subject:
Thermal Design
,
Air Cooling
,
Forced Convection
,
Heat Sink Design
Author:
B. Eric
Gross
John S.
Goodling
page:
754
-
760
Optimal Thermal Design Of Air Cooled Forced Convection Finned Heat Sinks-Experimental Verification
(Article)
Subject:
Thermal Design
,
Convection
,
Heat Sink Design
,
Experimental Verification
Author:
Roy W.
Knight
John S.
Goodling
B. Eric
Gross
page:
754
-
760
A Design Methodology For Vertical Channel Flow And Heat Transfer
(Article)
Subject:
Design Methodology
,
Channel Flow
,
Heat Transfer
,
Cooling Of Electronic Equipment
Author:
Larry E.
Hawkins
Douglas J.
Nelson
page:
761
-
770
Substrate Conduction Mechanisms In Convectively Cooled Simulated Electronic Packages
(Article)
Subject:
Electronic Packaging
,
Substrate Conduction
,
Mechanisms
,
Substrate
Author:
Humayun
Kabir
Alfonso
Ortega
page:
771
-
777
Thermal Design Space Prediction In Two-Phase Direct Liquid Cooling
(Article)
Subject:
Thermal Design
,
Critical Heat Flux
,
Boiling
,
Liquid Cooling
Author:
T.Y. Tom
Lee
Mali
Mahalingam
page:
778
-
785
Compact Liquid Cooling System For Small, Moveable Electronic Equipment
(Article)
Subject:
Liquid Cooling
,
Electronic Equipment Reliability
,
Mcm
,
Design Criteria
Author:
T.Y. Tom
Lee
James A.
Andrews
Peter
Chow
David
Saums
page:
786
-
793
Optimization Of The Thermal Design Of A Cryogenically Cooled Computer
(Article)
Subject:
Optimization
,
Thermal Design
,
Cryogenic Cooling
,
Heat Flux
Author:
James C.
Anderson
Robert J.
Krane
page:
794
-
805
Thermal Management Control Without Overshoot Using Combinations Of Boiling Liquids
(Article)
Subject:
Thermal Management
,
Combination
,
Boiling
,
Diodes
Author:
Mali
Mahalingam
T.Y. Tom
Lee
page:
806
-
814
Re-Entrant Cavity Surface Enhancements For Immersion Cooling Of Silicon Multichip Packages
(Article)
Subject:
Re-Entrant Flows
,
Cavity
,
Immersion
,
Silicon
Author:
John S.
Goodling
Richard C.
Jaeger
A.
Goyal
Sushil H.
Bhavnani
page:
815
-
822
A Technique For Enhancing Boiling Heat Transfer With Application To Cooling Of Electronic Equipment
(Article)
Subject:
Heat Transfer
,
Cooling Of Electronic Equipment
,
Boiling
,
Immersion
Author:
S. M
You
T. W
Simon
Avram
Bar-Cohen
page:
823
-
831
Heat Sink Optimization With Application To Microchannels
(Article)
Subject:
Heat Sink
,
Optimization
,
Microchannel
,
Thermal Resistance
Author:
Roy W.
Knight
D.J
Hall
John S.
Goodling
Richard C.
Jaeger
page:
832
-
842
The Effect Of Thermal Capacitance And Phase Change On Outside Plant Electronic Enclosures
(Article)
Subject:
Thermal Capacitance
,
Phase Change
,
Outside Plant
,
Electronic Enclosures
Author:
Renee C.
Estes
page:
843
-
849
Concurrent Thermal Designs Of Pcb'S: Balancing Accuracy With Time Constraints
(Article)
Subject:
Thermal Design
,
Pcb
,
Electronic Packaging
,
Time Constraints
Author:
Cristina H.
Amon
page:
850
-
859
Interconnect Technologies And The Thermal Performance Of Mcm
(Article)
Subject:
Interconnect
,
Thermal Performance
,
Mcm
,
Technologies And Applications
Author:
Burhan
Ozmat
page:
860
-
869
Surface Accumulation Rate Of Diffusing Species On Thin Gold Electroplates
(Article)
Subject:
Accumulation Rate
,
Diffusing S-Duct
,
Species
,
Thin Gold Electroplates
Author:
Laszlo
Revay
page:
870
-
875
Analysis Of A Conceptual Automated Rework Facility For Printed Wiring Assembly Manufacturing Systems
(Article)
Subject:
Conceptual Assembly Design
,
Automated Analysis
,
Wiring
,
Manufacturing Systems
Author:
John S.
Klegka
Morris R.
Driels
page:
876
-
883
Planar Magnetic Component Technology-A Review
(Article)
Subject:
Planar
,
Magnetic
,
Component Modelling
Author:
John
Barrett
page:
884
-
892
High Density Pin Board Matrix Switches For Automated Mdf Systems
(Article)
Subject:
High Density
,
Pin Board
,
Matrix Switches
,
Automated Mdf System
Author:
Tsuneo
Kanai
Shuichiro
Inagaki
Shigeru
Umemura
Shinichi
Hosokawa
page:
893
-
903
Evaluation Of Piezoresistive Coefficient Variation In Silicon Stress Sensors Using A Four-Point Bending Test Fixture
(Article)
Subject:
Bending Test
,
Piezoresistance Coefficients
,
Variation
,
Silicon
Author:
Richard C.
Jaeger
R. Wayne
Johnson
page:
904
-
914
The Single Chip Versus Multichip Packaging Option For Digital Cmos In The 1990'S
(Article)
Subject:
Single Chip Modules
,
Multichip Package
,
Digital Cmos
Author:
Raymond A.
Fillion
Constantine A.
Neugebauer
Wolfgang
Daum
page:
915
-
922
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